Development of High-Density Metal-Insulator-Metal Capacitors with Top and Side Contacts

MLA

Dewei Xu, et al. “Development of High-Density Metal-Insulator-Metal Capacitors with Top and Side Contacts.” 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), May 2023. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........54f3b90aedb94f6e7dd6d4f5b1d396f1&authtype=sso&custid=ns315887.

APA

Dewei Xu, Junyang Chen, Jimmy Koh, Emiko Motoyama, Meena Rajachidambaram, Jean Raymond Fakhoury, Radhika Kamlapurkar, Rachel Gantt, Daniel Palmieri, J. Nicholas Alexander, Bas Korevaar, Edward Gordon, Thomas Kauerauf, Teck Jung Tang, Robert Fox, Seung-Yeop Kook, & Owen Hu. (2023). Development of High-Density Metal-Insulator-Metal Capacitors with Top and Side Contacts. 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Chicago

Dewei Xu, Junyang Chen, Jimmy Koh, Emiko Motoyama, Meena Rajachidambaram, Jean Raymond Fakhoury, Radhika Kamlapurkar, et al. 2023. “Development of High-Density Metal-Insulator-Metal Capacitors with Top and Side Contacts.” 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), May. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........54f3b90aedb94f6e7dd6d4f5b1d396f1&authtype=sso&custid=ns315887.