HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems

MLA

Akram Ben Ahmed, et al. “HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems.” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 41, Apr. 2022, pp. 799–812. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........5a4f9f146cf1f67cda1e3f8dbdb17a18&authtype=sso&custid=ns315887.

APA

Akram Ben Ahmed, Xuan-Tu Tran, Abderazek Ben Abdallah, & Khanh N. Dang. (2022). HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 41, 799–812.

Chicago

Akram Ben Ahmed, Xuan-Tu Tran, Abderazek Ben Abdallah, and Khanh N. Dang. 2022. “HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems.” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 41 (April): 799–812. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........5a4f9f146cf1f67cda1e3f8dbdb17a18&authtype=sso&custid=ns315887.