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Fabrication of Sub-Micro Metal Tips for In-Plane Field Emission Research

Authors :
Li-Feng Wang
Jie Ying Tang
Lei Han
Jing Song
Qin Gan Huang
Source :
Key Engineering Materials. :28-32
Publication Year :
2013
Publisher :
Trans Tech Publications, Ltd., 2013.

Abstract

Fabrication of a novel in-plane field emission diode structure is presented. Sub-micro metal tips were obtained using a two-step lithography method. The Minimum width of the metal tips was less than 100nm, and the minimum spacing of 145.7nm was obtained. The I-V characters in atmospheric environment before and after the silicon etching were measured.

Subjects

Subjects :
Fabrication
Materials science
business.industry
Mechanical Engineering
Nanotechnology
Metal
Field electron emission
In plane
Mechanics of Materials
visual_art
visual_art.visual_art_medium
Optoelectronics
General Materials Science
business
Silicon etching
Lithography
Electron-beam lithography
Diode

Details

ISSN :
16629795
Database :
OpenAIRE
Journal :
Key Engineering Materials
Accession number :
edsair.doi...........5d1a44eb01f4cefb1d251fd0ada931d9

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