Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools—Part 2

The articles in this special section focus on leading-edge research and methodologies that address nagging challenges persisting in today’s 3-D integration, and the work being done to realize both 3-D and hybrid 2.5-D schemes for more fluid design and test platforms that can yield the most benefits at the least cost in the coming years. The selected papers cover a wide range of topics on 3-D ICs, from manufacturing process and 3-D integration technology to test methodologies, applications, and optimization algorithms.