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Stack engineering for ReRAM devices performance improvement

Authors :
Minghao Wu
Xinyi Li
Huaqiang Wu
Yue Bai
Ye Zhang
Zhiping Yu
He Qian
Source :
ISCAS
Publication Year :
2014
Publisher :
IEEE, 2014.

Abstract

Al/W:AlO x /WO y /W and Pt/AlO δ /Ta 2 O 5-x /TaO y /Pt multiple layers ReRAM devices have been fabricated and carefully studied. Experimental results exhibit significant performance improvement through the insertion of AlO x layer between the switching layer and the top electrode. Operation current is remarkably reduced, ON/OFF ratio is greatly increased, and stable multi-level operations have been successfully achieved. Multiple layers stack engineering has been proved as an efficient method to improve the performances of ReRAM devices.

Details

Database :
OpenAIRE
Journal :
2014 IEEE International Symposium on Circuits and Systems (ISCAS)
Accession number :
edsair.doi...........60931b57689ca9e1b1574d58b8dde8d6
Full Text :
https://doi.org/10.1109/iscas.2014.6865268