Electrodeposition of Tin-Zinc Eutectics Alloy and Codeposition Mechanism of Zinc for Low Temperature Lead-Free Soldering

MLA

Toshio Nakatani, et al. “Electrodeposition of Tin-Zinc Eutectics Alloy and Codeposition Mechanism of Zinc for Low Temperature Lead-Free Soldering.” Journal of Japan Institute of Electronics Packaging, vol. 6, Jan. 2003, pp. 222–27. EBSCOhost, https://doi.org/10.5104/jiep.6.222.

APA

Toshio Nakatani, Keigo Obata, Ei Uchida, Hidemi Nawafune, & Kensuke Akamatsu. (2003). Electrodeposition of Tin-Zinc Eutectics Alloy and Codeposition Mechanism of Zinc for Low Temperature Lead-Free Soldering. Journal of Japan Institute of Electronics Packaging, 6, 222–227. https://doi.org/10.5104/jiep.6.222

Chicago

Toshio Nakatani, Keigo Obata, Ei Uchida, Hidemi Nawafune, and Kensuke Akamatsu. 2003. “Electrodeposition of Tin-Zinc Eutectics Alloy and Codeposition Mechanism of Zinc for Low Temperature Lead-Free Soldering.” Journal of Japan Institute of Electronics Packaging 6 (January): 222–27. doi:10.5104/jiep.6.222.