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Simulation and Optimization of Surface Acoustic Wave Devices With High Electromechanical Coupling Factor and Zero Temperature Coupling Coefficient by Pattern Piezoelectric Layer

Authors :
Hongyu Dun
Xu Han
Fang Wang
Weican Nie
Zuodong Yang
Lintao Zhou
Fengpu Zhang
Han Sun
Yemei Han
Deqing Kong
Kailiang Zhang
Source :
IEEE Sensors Journal. 23:10597-10604
Publication Year :
2023
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2023.

Subjects

Subjects :
Electrical and Electronic Engineering
Instrumentation

Details

ISSN :
23799153 and 1530437X
Volume :
23
Database :
OpenAIRE
Journal :
IEEE Sensors Journal
Accession number :
edsair.doi...........64d65267f642a0f75faa00d2a0a7630f

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