Measurement and Crosstalk Analysis of Hexagonal TSV Bundle in 3D ICs

MLA

Zhangming Zhu, et al. “Measurement and Crosstalk Analysis of Hexagonal TSV Bundle in 3D ICs.” 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT), Sept. 2020. EBSCOhost, https://doi.org/10.1109/icmmt49418.2020.9387011.

APA

Zhangming Zhu, Wang Liwei, Chenbing Qu, & Yunfei En. (2020). Measurement and Crosstalk Analysis of Hexagonal TSV Bundle in 3D ICs. 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT). https://doi.org/10.1109/icmmt49418.2020.9387011

Chicago

Zhangming Zhu, Wang Liwei, Chenbing Qu, and Yunfei En. 2020. “Measurement and Crosstalk Analysis of Hexagonal TSV Bundle in 3D ICs.” 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT), September. doi:10.1109/icmmt49418.2020.9387011.