Cite
Femtosecond laser modification combined with chemical etching to achieve high-quality cutting of millimeter-thick fused silica
MLA
Youwang Hu, et al. “Femtosecond Laser Modification Combined with Chemical Etching to Achieve High-Quality Cutting of Millimeter-Thick Fused Silica.” Optik, vol. 269, Nov. 2022, p. 169861. EBSCOhost, https://doi.org/10.1016/j.ijleo.2022.169861.
APA
Youwang Hu, Yalong Wang, Xianshan Dong, Xiang Xi, Chao Long, Haoning Zheng, Yao Wang, Xiaoyan Sun, & Ji’an Duan. (2022). Femtosecond laser modification combined with chemical etching to achieve high-quality cutting of millimeter-thick fused silica. Optik, 269, 169861. https://doi.org/10.1016/j.ijleo.2022.169861
Chicago
Youwang Hu, Yalong Wang, Xianshan Dong, Xiang Xi, Chao Long, Haoning Zheng, Yao Wang, Xiaoyan Sun, and Ji’an Duan. 2022. “Femtosecond Laser Modification Combined with Chemical Etching to Achieve High-Quality Cutting of Millimeter-Thick Fused Silica.” Optik 269 (November): 169861. doi:10.1016/j.ijleo.2022.169861.