Design and Performance Evaluation of Al2O3-SiC Composite for Direct-Bonded Copper Substrate

A computational material design approach is applied to propose a novel ceramic material for direct-bonded copper (DBC) substrate with enhanced thermal and structural performance. The material design inherently consists of many competing requirements that require careful decisions regarding key trade-offs in terms of material composition, inclusion size, shape, and distribution to achieve the target properties. The alumina-silicon (Al2O3-SiC) composite, as compared to commercial alumina, used in DBC is found to be the most suitable design among other candidates with improved thermal and structural properties. In order to study the performance characteristics and the effects of the new ceramic composite with improved properties in terms of structural behavior and fatigue life of the DBC substrate, the normal working and extreme thermal cycling conditions were simulated and analyzed using finite element method. The temperature, strain, and localized stress distribution within the substrate at a steady-state condition were analyzed, and the improved Coffin–Manson law was used to calculate the fatigue life of the substrate under extreme thermal cycling conditions. The proposed Al2O3-SiC composite is found to be more robust than the commercial alumina as DBC substrates considering the thermal–mechanical performance. The fatigue life cycle of the DBC substrate with the proposed material is predicted to be about two times longer than the commercial alumina DBC ceramic under transient thermal cycling test.