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Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios

Authors :
Bhanu Pratap Singh
Shirong Li
Khaled Redwan Choudhury
Staffan Norrga
Hans-Peter Nee
Source :
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publication Year :
2023
Publisher :
IEEE, 2023.

Details

Database :
OpenAIRE
Journal :
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Accession number :
edsair.doi...........68350624047d979d644901d0e63f08b6

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