Methodology for the additive manufacture of embedded conductive paths connecting microelectromechanical sensors using conductive and flexible filaments with extrusion devices

Purpose The purpose of this study is to explore a methodology for connecting microelectromechanical system sensors – i.e. inertial measurement unit (IMU) – to an Arduino-based microcontroller, using graphene-based conductive filament and flexible thermoplastic polyurethane (FTPU) filament and low-cost dual material extrusion technology. Design/methodology/approach A series of electrical tests were carried out to determine the maximum resistance the conductive paths may take to connect printed circuit boards (PCB). To select the most suitable printing material, three types of conductive filaments were examined. Then an experiment was carried out to find the best printing parameters in terms of printing speed, printing temperature and layer height to minimise resistivity. The size of the conductive path was also analysed. A final prototype was designed and printed according to optimised printing settings and maximum allowable resistances for each line and considering different geometries and printing strategies to reduce cross-contamination among paths. Findings For the Black Magic 3D conductive filament, the printing speed and layer height played a significant role regarding resistivity, while the printing temperature was not very important. The infill pattern of the conductive paths had to be aligned with the expected current path, while using air gaps between two adjacent paths resulted in the best approach to reducing cross-contamination. Moreover, the cross-section size of the conductive path did not affect the volume resistivity. When combined with FTPU filament constraints, the prototype yielded suitable electrical performance and printing quality when printed at a temperature of 220°C, speed of 20 mm/s and layer height of 0.2 mm. Originality/value This paper explores a systematic methodology for the additive manufacturing of commercial conductive material using low-cost extrusion technology to connect complex electronics when data transmission is a key feature.