Integration of Functional Circuits into FDM Parts

The incorporation of electronic circuitry into additively manufactured thermoplastic parts is a highly desirable innovation enabler. Applications include embedding signal traces into custom air or ground vehicle components, creation of complex interconnect devices exploiting the design freedom of 3D printers, or as a way to create various grounding, shielding, sensing or antenna patterns on custom structures. Stratasys has explored multiple approaches for creating selective metallization on 3D printed plastic parts. Earlier publications [1] described evaluations of metal-based ink deposition methods such as ink jet and aerosol jet. More recently we have explored the use of Laser Direct Structuring, (LDS) thermoplastic resins in our 3D printers. With LDS technology, parts are selectively metallized after 3D part build through a laser imaging and electroless plating process. Finally, some early feasibility work has been attempted using inherently electrically conductive materials. In this paper, the various methods evaluated for integration of metal traces with 3D parts will be discussed, along with part examples and performance comparisons.