Cite
Setting up 3D sequential integration for back-illuminated CMOS image sensors with highly miniaturized pixels with low temperature fully depleted SOI transistors
MLA
B. Giffard, et al. “Setting up 3D Sequential Integration for Back-Illuminated CMOS Image Sensors with Highly Miniaturized Pixels with Low Temperature Fully Depleted SOI Transistors.” 2008 IEEE International Electron Devices Meeting, Dec. 2008. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........7197780839b41e2a83bbb291407cbe1b&authtype=sso&custid=ns315887.
APA
B. Giffard, N. Moussy, Perrine Batude, P. Magnan, X. Gagnard, Pascal Ancey, P. Coudrain, Maud Vinet, C. Leyris, Yvon Cazaux, A. Pouydebasque, & S. Ricq. (2008). Setting up 3D sequential integration for back-illuminated CMOS image sensors with highly miniaturized pixels with low temperature fully depleted SOI transistors. 2008 IEEE International Electron Devices Meeting.
Chicago
B. Giffard, N. Moussy, Perrine Batude, P. Magnan, X. Gagnard, Pascal Ancey, P. Coudrain, et al. 2008. “Setting up 3D Sequential Integration for Back-Illuminated CMOS Image Sensors with Highly Miniaturized Pixels with Low Temperature Fully Depleted SOI Transistors.” 2008 IEEE International Electron Devices Meeting, December. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........7197780839b41e2a83bbb291407cbe1b&authtype=sso&custid=ns315887.