Generation of metal patterns by topography-directed deposition

In this work, we present a method for fabricating high-resolution metal arrays based on the topography-mediated electrochemical deposition (ECD) process. By this approach, silver arrays of 200nm feature size can be obtained with the mediation of microscale patterns on silicon wafer. It should be possible to extend this method to other materials and substrates, which may have applications in sensors, optical and optoelectronic devices.