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An Analysis of Evolving Package Reliability Test Methodologies for Wireless Applications

Authors :
Michael Ferrara
Source :
International Symposium on Microelectronics. 2013:000647-000650
Publication Year :
2013
Publisher :
IMAPS - International Microelectronics Assembly and Packaging Society, 2013.

Abstract

Increased demands on time to market and new technology introductions create challenges for package reliability testing to be as efficient and comprehensive as possible within a limited time frame. Further, new package technologies and their interactions pose additional reliability risk with the need to be carefully evaluated. This paper will analyze this trend and identify solutions in the form of better and more efficient upfront methodologies such as potential problem analysis, delta analysis, detailed statistical analysis, and daisy chain/ test to failure methodologies. Future trends will also be evaluated.

Details

ISSN :
23804505
Volume :
2013
Database :
OpenAIRE
Journal :
International Symposium on Microelectronics
Accession number :
edsair.doi...........770c70620d708768d485b2a046f0a5d4
Full Text :
https://doi.org/10.4071/isom-2013-wp22