Back to Search
Start Over
An Analysis of Evolving Package Reliability Test Methodologies for Wireless Applications
- Source :
- International Symposium on Microelectronics. 2013:000647-000650
- Publication Year :
- 2013
- Publisher :
- IMAPS - International Microelectronics Assembly and Packaging Society, 2013.
-
Abstract
- Increased demands on time to market and new technology introductions create challenges for package reliability testing to be as efficient and comprehensive as possible within a limited time frame. Further, new package technologies and their interactions pose additional reliability risk with the need to be carefully evaluated. This paper will analyze this trend and identify solutions in the form of better and more efficient upfront methodologies such as potential problem analysis, delta analysis, detailed statistical analysis, and daisy chain/ test to failure methodologies. Future trends will also be evaluated.
Details
- ISSN :
- 23804505
- Volume :
- 2013
- Database :
- OpenAIRE
- Journal :
- International Symposium on Microelectronics
- Accession number :
- edsair.doi...........770c70620d708768d485b2a046f0a5d4
- Full Text :
- https://doi.org/10.4071/isom-2013-wp22