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Simulation of Wire Bonding Process Using Explicit Fem with Ale Remeshing Technology
- Source :
- Journal of Mechanics. 36:47-54
- Publication Year :
- 2019
- Publisher :
- Oxford University Press (OUP), 2019.
-
Abstract
- Thermosonic wire bonding is a common fabrication process for connecting devices in electronic packaging. However, when the free air ball (FAB) is compressed onto the I/O pad of the chip during bonding procedure, chip cracking may occur if the contact pressure is too large. This study proposes an effective simulation technique that can predict the wire ball geometry after bonding in an accurate range. The contact force obtained in the simulation can be used for possible die cracking behavior evaluation. The simulation in this study used the explicit time integration scheme to deal with the time marching problem, and the second-order precision arbitrary Lagrangian-Eulerian (ALE) algorithm was used to deal with the large deformation of the wire ball during the bonding process. In addition, the equilibrium smoothing algorithm in LS-DYNA can make the contact behavior and geometry of the bonding wire almost the same as the experiment, which can also significantly reduce the distortion of the mesh geometry after remeshing.
- Subjects :
- 010302 applied physics
Wire bonding
Materials science
Applied Mathematics
Mechanical Engineering
Electronic packaging
Mechanical engineering
02 engineering and technology
021001 nanoscience & nanotechnology
Condensed Matter Physics
Chip
01 natural sciences
Finite element method
Contact force
0103 physical sciences
Ball (bearing)
LS-DYNA
0210 nano-technology
Smoothing
Subjects
Details
- ISSN :
- 18118216 and 17277191
- Volume :
- 36
- Database :
- OpenAIRE
- Journal :
- Journal of Mechanics
- Accession number :
- edsair.doi...........77fc441f390c68676f89aad14f94a359