Impact of Liner Metals on Copper Resistivity at Beyond 7nm Dimensions

Authors :: C.-C. Yang
Terry A. Spooner
James Chingwei Li
J. Maniscalco
Hosadurga Shobha
Griselda Bonilla
Motoyama Koichi
Hsiang-Jen Huang
Takeshi Nogami
Theodorus E. Standaert
Nicholas A. Lanzillo
Source :: 2018 IEEE International Interconnect Technology Conference (IITC).
Publication Year :: 2018
Publisher :: IEEE, 2018.
Abstract: The impacts of ruthenium and cobalt liners on copper resistivity have been investigated at beyond 7nm dimensions. Liner metal conduction was carefully evaluated in a Cu resistivity derivation using the temperature coefficient of resistivity (TCR) approach. Cu resistivity with Ru liner is higher than with a Co liner by 10-15%, which is verified by RC plot. The resistivity difference is attributed to interface scattering and possibly grain boundary scattering. Interface ab initio calculations show 3-7% increase of Cu resistivity from Co liner to Ru liner.

Subjects :: 010302 applied physics
Materials science
Scattering
chemistry.chemical_element
02 engineering and technology
Conductivity
021001 nanoscience & nanotechnology
Thermal conduction
01 natural sciences
Copper
chemistry
Electrical resistivity and conductivity
0103 physical sciences
Grain boundary
Composite material
0210 nano-technology
Temperature coefficient
Cobalt

Database :: OpenAIRE
Journal :: 2018 IEEE International Interconnect Technology Conference (IITC)
Accession number :: edsair.doi...........79b05f45f1c05abbfd885173d4f7b899
Full Text :: https://doi.org/10.1109/iitc.2018.8430472