Influence of the Brittle Behavior of Work Materials on Microgrooving

An electroplated diamond wire tool is frequently used for the machining of hard and brittle materials such as silicon ingots, magnetic materials, ceramics, and sapphires. This study aims to examine the influence of brittle behavior of work materials on machinability (including tool wear); therefore, we conduct dynamic ultramicro hardness measurements and microgrooving experiments for three types of ceramics. The results indicate that the groove depth of a work material tends to increase with the processing time. Moreover, material properties of a work material, such as hardness and toughness, have a significant impact on the fluctuations in its groove depth. However, kerf width of a work material does not depend on the processing conditions and material properties. In addition, a faster relative velocity improves processing efficiency but also increases tool wear.