Cite

Influence of the topology on thermal dissipation in high power density GaAs devices

MLA

J. Tasselli, et al. “Influence of the Topology on Thermal Dissipation in High Power Density GaAs Devices.” Solid-State Electronics, vol. 46, Nov. 2002, pp. 1919–24. EBSCOhost, https://doi.org/10.1016/s0038-1101(02)00136-3.



APA

J. Tasselli, J.P. Bailbe, P. Souverain, Thierry Camps, & A. Marty. (2002). Influence of the topology on thermal dissipation in high power density GaAs devices. Solid-State Electronics, 46, 1919–1924. https://doi.org/10.1016/s0038-1101(02)00136-3



Chicago

J. Tasselli, J.P. Bailbe, P. Souverain, Thierry Camps, and A. Marty. 2002. “Influence of the Topology on Thermal Dissipation in High Power Density GaAs Devices.” Solid-State Electronics 46 (November): 1919–24. doi:10.1016/s0038-1101(02)00136-3.