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Ultra-thin gate dielectrics: they break down, but do they fail?

Authors :
B. E. Weir
D. Hwang
Muhammad A. Alam
Gregory Timp
Frieder H. Baumann
Yi Ma
Don Monroe
T.W. Sorsch
P.J. Silverman
K.S. Krisch
Glenn B. Alers
C.T. Liu
Source :
International Electron Devices Meeting. IEDM Technical Digest.
Publication Year :
2002
Publisher :
IEEE, 2002.

Abstract

We study breakdown in high-quality 2-7 nm gate dielectrics, and find that soft breakdown becomes more likely for thinner oxides and for oxides stressed at lower voltages. For 2 nm oxides, an increase in gate noise is the only precise indication of soft breakdown. For many applications, devices should remain functional with the level of gate noise we have observed, after soft breakdown.

Details

Database :
OpenAIRE
Journal :
International Electron Devices Meeting. IEDM Technical Digest
Accession number :
edsair.doi...........8789901b2d6a0d3c2fa0c92a65f06e55
Full Text :
https://doi.org/10.1109/iedm.1997.649463