Transient liquid phase bonding with Ga-based alloys for electronics interconnections

Subjects

Subjects :

Strategy and Management
Management Science and Operations Research
Industrial and Manufacturing Engineering

Details

ISSN :

15266125

Volume :

84

Database :

OpenAIRE

Journal :

Journal of Manufacturing Processes

Accession number :

edsair.doi...........89d97b58d3ba495ff6c7f0fadf8ac401