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Measurement study of residual stress on tungsten-rhenium thin film thermocouples by nanoindentation technology
- Source :
- NEMS
- Publication Year :
- 2017
- Publisher :
- IEEE, 2017.
-
Abstract
- In this paper, Nano-indentation technology is used to test the mechanical property of the tungsten-rhenium thin film, including hardness, elastic modulus and residual stress. The effects of different heat treatment temperature and different substrates on the hardness and elastic modulus of tungsten-rhenium films were studied. We research three substrates which are silicon carbide ceramic, aluminum oxide ceramic and zirconium oxide ceramic. Test results show that the tungsten-rhenium films on aluminum oxide ceramic shows the biggest values of elastic modulus and the smallest on silicon carbide ceramic. However, value of hardness is biggest on zirconium oxide ceramic and smallest on aluminum oxide ceramic. Besides, the heat treatment temperature has high influence on hardness and elastic modulus of tungsten-rhenium film. And under different substrates, the hardness and elastic modulus of film on zirconium oxide ceramic is the most sensitive to heat treatment temperature. By contrast, silicon carbide ceramic is the least.
- Subjects :
- 010302 applied physics
Zirconium
Materials science
Metallurgy
chemistry.chemical_element
Ceramic engineering
02 engineering and technology
Tungsten
Nanoindentation
021001 nanoscience & nanotechnology
01 natural sciences
chemistry.chemical_compound
chemistry
Residual stress
visual_art
0103 physical sciences
visual_art.visual_art_medium
Silicon carbide
Ceramic
0210 nano-technology
Elastic modulus
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
- Accession number :
- edsair.doi...........8a195e3ac81f69a464e4c55984892545