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Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface
- Source :
- Acta Physico-Chimica Sinica. 29:2579-2584
- Publication Year :
- 2013
- Publisher :
- Acta Physico-Chimica Sinica & University Chemistry Editorial Office, Peking University, 2013.
-
Abstract
- National Natural Science Foundation of China [21021002]; National Key Basic Research Program of China (973) [2009CB930703]
Details
- ISSN :
- 10006818
- Volume :
- 29
- Database :
- OpenAIRE
- Journal :
- Acta Physico-Chimica Sinica
- Accession number :
- edsair.doi...........8a2519f38e178cfec19941762c64da7b