Thermal management in embedded systems using MEMS

1. a exible thermal management system with the capability to remain viable for several generations of increased microprocessor performance and power, 2. simpli cation of the packaging, by eliminating the cooling core concept and replacing it with an innovative \self-ducting" design based on 3-D stacking of computational nodes, 3. microelectromechanical structures (MEMS) that allow active, dynamic management of localized heat dissipation by directly adjusting the uid boundary layer, 4. integrated thermal instrumentation circuits to monitor and control the local environment (e.g., microcells for chips and simple die for systems), and 5. embedded algorithms for intelligent and robust thermal management.