Back to Search Start Over

Novel Co/Ni bi-layer salicidation for 45 nm gate technology

Authors :
M.S. Liang
W.S. Shue
C.W. Chang
M.Y. Wang
C.T. Lin
C.H. Hsieh
C.M. Wu
Source :
2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407).
Publication Year :
2004
Publisher :
Japan Soc. Applied Phys, 2004.

Abstract

We present the novel concept of "bi-layer metal salicidation" by using Co/Ni stacked films, which showed better film chemical and plasma resistance than pure NiSi. NFET device performance demonstrates 5% Idsat/Ioff (100 nA) improvement and no degradation in terms of sheet resistance, junction leakage and isolation than pure NiSi. We also prove the approach can be implemented easily to manufacturing with conventional post salicide process similar to CoSi/sub 2/ for 45 nm gate technology and below.

Details

Database :
OpenAIRE
Journal :
2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407)
Accession number :
edsair.doi...........8c81e715e8db0eac076336fd8bea10d8
Full Text :
https://doi.org/10.1109/vlsit.2003.1221133