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Thermoelectric Half-Heusler compounds TaFeSb and Ta1-xTixFeSb (0 ≤ x ≤ 0.11): Formation and physical properties
- Source :
- Intermetallics. 111:106468
- Publication Year :
- 2019
- Publisher :
- Elsevier BV, 2019.
-
Abstract
- We report on the formation, physical-chemical, as well as elastic and mechanical properties of the novel Half-Heusler (HH) compound TaFeSb that forms during a solid-state reaction from TaSb2 and TaFe2 in the temperature range between 800 and 850 °C. TaFeSb behaves as a semiconductor, and changes the conductivity type either on temperature or composition. Transport properties of TaFeSb and Ta1-xTixFeSb (0 ≤ x ≤ 0.11) were measured in the temperature range from 4.2 to 823 K, and the effect of titanium on thermoelectric and mechanical properties of Ta1-xTixFeSb was investigated. The Ta/Ti substitution results in a significant increase of the thermoelectric power factor to exciting values of above 6 mW/m⋅K2. In combination with a suppressed phonon thermal conductivity, due to a unique role of Ti, an enhanced figure of merit, ZT900K =1.0 (for Ta0.94Ti0.06FeSb) is obtained, close to the highest values reported for Hf-free p-type HH-systems. In addition, experimental results obtained in this study are discussed and analyzed in the context of ab-initio Density Functional Theory (DFT) calculations.
- Subjects :
- 010302 applied physics
Materials science
business.industry
Mechanical Engineering
Metals and Alloys
Thermodynamics
chemistry.chemical_element
Context (language use)
02 engineering and technology
General Chemistry
Atmospheric temperature range
Conductivity
021001 nanoscience & nanotechnology
01 natural sciences
Semiconductor
chemistry
Mechanics of Materials
0103 physical sciences
Thermoelectric effect
Materials Chemistry
Figure of merit
Density functional theory
0210 nano-technology
business
Titanium
Subjects
Details
- ISSN :
- 09669795
- Volume :
- 111
- Database :
- OpenAIRE
- Journal :
- Intermetallics
- Accession number :
- edsair.doi...........8d64a6d65fa79eb7f94b78600845d1ba
- Full Text :
- https://doi.org/10.1016/j.intermet.2019.04.011