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Hybrid hermetic housings for active implantable neural device

Authors :
Weiguo Chen
Ming-Yuan Cheng
Ramona Damalerio
Ruiqi Lim
Source :
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Publication Year :
2017
Publisher :
IEEE, 2017.

Abstract

In this work, a novel hermetic packaging method using titanium and ceramic casing is proposed for long term implantable medical device. The proposed titanium-ceramic casing for implants has a better radio frequency (RF) transparency advantage as comparison to metallic materials. The proposed hermetic packaging method is used to integrate a high channels neural probe array and an active circuit module through a high density flexible cable without feedthrough integration. Hence, the profile of the integrated device achieved is as low as three millimeter and it is placed in the subdermal space. To evaluate the hermeticity of the device packaging, a helium gas leakage test was conducted and discussed. In vitro cytotoxicity test was also performed and evaluated.

Details

Database :
OpenAIRE
Journal :
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Accession number :
edsair.doi...........8dfde752a488d838c13c1a618aa31484