Wafer-scale integration of antimonide-based MWIR FPAs

High performance infrared focal plane arrays (FPAs) play a critical role in a wide range of imaging applications. However the high cost associated with the required cooling and serially processed die-level hybridization is major barrier that has thwarted Mid-wavelength Infrared (MWIR) detector technology from penetrating largevolume, low-cost markets. Under the Defense Advanced Research Projects Agency (DARPA) WIRED program, the HRL team has developed a wafer level integration schemes to fabricate large format Antimonidebased MWIR FPAs on Si Read Out Integrated Circuit (ROIC) as a means to achieve significant fab cost reduction and enhanced production scalability. The DARPA-hard challenge we are addressing is the thermal and stress management in the integration of two dissimilar materials to avoid detector and ROIC degradation and to maintain structure integrity at the wafer scale. In addition, a digital ROIC with extremely large well capacity was designed and taped-out, in order to increase the operating temperature of the FPAs. In this talk, we discuss our progress under the DARPA WIRED program.