The use of automatic dielectrometry for autoclave moulding of low void composites

Moulding thermoset resin laminates under autoclave conditions removes the possibility of using resin sampling to determine the gelation point of the resin. The gelation point is critical, since it is then that pressure has to be applied to achieve optimum mechanical properties. This paper describes the use of automatic dielectrometry to monitor the process under autoclave conditions, giving an accurate prediction of the gel point. The need to ‘stage’ the prepreg system is eliminated, and optimum mechanical properties of the resulting laminate can be obtained.