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A Study on the Reliability of Micro-Vias in Printed Circuit Boards During Thermal Cycling

Authors :
Young Bae Ko
Hyung-Pil Park
Gyunmyoung Park
Seung-Hyun Cho
Source :
Advanced Science Letters. 19:3683-3687
Publication Year :
2013
Publisher :
American Scientific Publishers, 2013.

Subjects

Subjects :
Printed circuit board
General Energy
Health (social science)
Reliability (semiconductor)
Materials science
General Computer Science
General Mathematics
General Engineering
Temperature cycling
Automotive engineering
General Environmental Science
Education

Details

ISSN :
19367317 and 19366612
Volume :
19
Database :
OpenAIRE
Journal :
Advanced Science Letters
Accession number :
edsair.doi...........975881856da2bc6349d0671852225c05
Full Text :
https://doi.org/10.1166/asl.2013.5193
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