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A Novel Quantitative Adhesion Measurement Method for Thin Polymer and Metal Layers for Microelectronic Applications

Authors :
Markus Woehrmann
Piotr Mackowiak
Michael Schiffer
Klaus-Dieter Lang
Martin Schneider-Ramelow
Source :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Accession number :
edsair.doi...........99fe3d5795be50f294fb5dc82b9aaf8d

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