Back to Search
Start Over
Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives
- Source :
- First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
- Publication Year :
- 2002
- Publisher :
- IEEE, 2002.
-
Abstract
- Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.
Details
- Database :
- OpenAIRE
- Journal :
- First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
- Accession number :
- edsair.doi...........9caea5f4b82f7917ce713a8f9119b6a0
- Full Text :
- https://doi.org/10.1109/polytr.2001.973276