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Fabrication of Freestanding Metallic Ni-Mo-W Microcantilever Beams With High Dimensional Stability
- Source :
- Journal of Microelectromechanical Systems. 29:329-337
- Publication Year :
- 2020
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2020.
-
Abstract
- Recent studies have elucidated a promising balance of physical and mechanical properties of sputter deposited nickel-molybdenum-tungsten (Ni-Mo-W) films that have a unique nanotwinned microstructure and promising potential for use in high temperature microelectromechanical systems (MEMS). The current study was undertaken to establish the feasibility of making nanotwinned Ni-Mo-W microcantilevers with standard microfabrication processing, to assess their dimensional stability, and to demonstrate the possibility of using nanotwinned Ni-Mo-W in metal MEMS devices. Deposition of Ni-Mo-W films in commercial sputtering chambers revealed a wide processing window for the formation of the requisite nanotwinned microstructure. Conventional photolithography and etchants were employed to shape blanket Ni-Mo-W films into freestanding microcantilever beams. Monitoring microcantilever deflections via interferometry provided a direct measure of residual stresses and overall dimensional stability. Heat treatments of 200°C and 400°C were used to mimic wafer bonding temperatures. At 400°C, microcantilevers exhibited modest stress relaxation, yielding beam deflection profiles on the nanometer scale and portending dimensional stability and control for future metal MEMS devices.
- Subjects :
- 010302 applied physics
Microelectromechanical systems
Materials science
Fabrication
Wafer bonding
business.industry
Mechanical Engineering
02 engineering and technology
Sputter deposition
021001 nanoscience & nanotechnology
01 natural sciences
law.invention
law
Sputtering
Residual stress
0103 physical sciences
Optoelectronics
Electrical and Electronic Engineering
Photolithography
0210 nano-technology
business
Microfabrication
Subjects
Details
- ISSN :
- 19410158 and 10577157
- Volume :
- 29
- Database :
- OpenAIRE
- Journal :
- Journal of Microelectromechanical Systems
- Accession number :
- edsair.doi...........a148c938d962f3b0c7f032b71436b97a
- Full Text :
- https://doi.org/10.1109/jmems.2019.2958862