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Modeling of pore formation in solid

Authors :
PengSheng Wei
S. Y. Hsiao
Mei-Ling Wu
Source :
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publication Year :
2012
Publisher :
IEEE, 2012.

Abstract

Quality and microstructure of materials are strongly affected by the shapes of pores in solids, which are encountered in almost all the packaging, micro-electro-mechanical systems (MEMS), and manufacturing fields. This study theoretically analyzes the mechanisms of an entrapped micro-bubble as a pore in the solid. A phase diagram, as introduced previously to be satisfied by interfacial normal stress balance, can be used to control and delineate the growing path and final shape of a pore. The predicted pore shape agrees with experimental results.

Details

Database :
OpenAIRE
Journal :
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Accession number :
edsair.doi...........a31b85f2e2c8e1c0b1f84be10517bd20
Full Text :
https://doi.org/10.1109/impact.2012.6420238