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A PCB based package with thermal resistance improvement
- Source :
- 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe).
- Publication Year :
- 2021
- Publisher :
- IEEE, 2021.
Details
- Database :
- OpenAIRE
- Journal :
- 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)
- Accession number :
- edsair.doi...........a3b3f4cda0138022412502a9f2cdb63f