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Effect of NC pins ESD test on the reliability of integrated circuits with high density BGA package

Authors :
Jian Lu
Yong Ma
Kaihong Zhang
Yongjian Yu
Huibin Zhang
Source :
Microelectronics Reliability. 139:114844
Publication Year :
2022
Publisher :
Elsevier BV, 2022.

Subjects

Subjects :
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials

Details

ISSN :
00262714
Volume :
139
Database :
OpenAIRE
Journal :
Microelectronics Reliability
Accession number :
edsair.doi...........a63f77b24ec7b488be4acbfee43986d1
Full Text :
https://doi.org/10.1016/j.microrel.2022.114844
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