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Thermal Management and Communication Virtualization for Reliability Optimization in MPSoCs
- Source :
- Dependable Embedded Systems ISBN: 9783030520168
- Publication Year :
- 2020
- Publisher :
- Springer International Publishing, 2020.
-
Abstract
- This chapter covers the interdependencies of temperature and the reliable operation of multiprocessor systems on chip (MPSoC). Starting with the assessment of temperature values for the different cores either through measurement or estimation, it is shown which methods on system level can be applied to balance the thermal stress in the system and thus to come to an evenly distributed probability of errors. Special focus is given to task migration as a system-level means, which is supported by an on-chip interconnect virtualization technique that eases fast and transparent switch-over of communication channels. Overall, it is shown how mechanisms on different levels of the system stack can be combined to cooperate across layers for improving system reliability.
- Subjects :
- Interconnection
Focus (computing)
Computer science
Distributed computing
Reliability (computer networking)
020208 electrical & electronic engineering
Multiprocessing
02 engineering and technology
MPSoC
Virtualization
computer.software_genre
020202 computer hardware & architecture
Task (computing)
Stack (abstract data type)
0202 electrical engineering, electronic engineering, information engineering
computer
Subjects
Details
- ISBN :
- 978-3-030-52016-8
- ISBNs :
- 9783030520168
- Database :
- OpenAIRE
- Journal :
- Dependable Embedded Systems ISBN: 9783030520168
- Accession number :
- edsair.doi...........adb7979f504181ba6cb664e3890e3def
- Full Text :
- https://doi.org/10.1007/978-3-030-52017-5_8