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Interconnected network of Ag and Cu in bioplastics for ultrahigh electromagnetic interference shielding efficiency with high thermal conductivity

Authors :
Dohoon Kim
Young Jin Lee
Kyung Hyun Ahn
Source :
Composites Communications. 30:101093
Publication Year :
2022
Publisher :
Elsevier BV, 2022.

Details

ISSN :
24522139
Volume :
30
Database :
OpenAIRE
Journal :
Composites Communications
Accession number :
edsair.doi...........b032dab989b9b2a78fa1735e32a0de42
Full Text :
https://doi.org/10.1016/j.coco.2022.101093