Contact module at dense gate pitch technology challenges

MLA

Steven Demuynck, et al. “Contact Module at Dense Gate Pitch Technology Challenges.” IEEE International Interconnect Technology Conference, May 2014. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........b139f4f2e595de2cd7be8c1a421532d4&authtype=sso&custid=ns315887.

APA

Steven Demuynck, Thomas Kauerauf, Ming Mao, J. Versluijs, K. Croes, Marc Schaekers, Jürgen Bömmels, C. Wu, Eddy Kunnen, Antony Premkumar Peter, & Lieve Teugels. (2014). Contact module at dense gate pitch technology challenges. IEEE International Interconnect Technology Conference.

Chicago

Steven Demuynck, Thomas Kauerauf, Ming Mao, J. Versluijs, K. Croes, Marc Schaekers, Jürgen Bömmels, et al. 2014. “Contact Module at Dense Gate Pitch Technology Challenges.” IEEE International Interconnect Technology Conference, May. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........b139f4f2e595de2cd7be8c1a421532d4&authtype=sso&custid=ns315887.