Stacking 4' Si Wafer with Parallel 3-Stepped Micro-Trenches to Deposit Superconducting Material for Magnetic Energy Storage

Authors :: Yasuhiro Suzuki
T. Motohiro
T. Hioki
Minoru Sasaki
Source :: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Publication Year :: 2019
Publisher :: IEEE, 2019.
Abstract: A 89m-long spiral trench in 4” Si wafer is fabricated as the coil mold for the compact superconducting magnetic energy storage. Seven parallel 3-stepped micro-trench can reduce the disconnection risk caused by defects being the safety each other.

Subjects :: Fabrication
Materials science
Silicon
business.industry
Stacking
chemistry.chemical_element
Superconducting magnetic energy storage
chemistry
Electromagnetic coil
Trench
Optoelectronics
Wafer
Spiral (railway)
business

Database :: OpenAIRE
Journal :: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Accession number :: edsair.doi...........b1bb5bb45639cf831b9ca5fdbecb8da4
Full Text :: https://doi.org/10.23919/ltb-3d.2019.8735416

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