Influence of Grain Boundary Diffusion Fluxes of Aluminum on Strength Properties and Creep of Copper and Cu-0.9%Vol Al2O3 Nanocomposite

The practical application of nanostructured materials obtained by severe plastic deformation involves two main problems at least. Firstly, there is the instability of non-equilibrium structure connected with high energy accumulated by severe plastic deformation [1]. The instability is the reason for intense softening at relatively low temperature. This temperature is close to room temperature for several nanostructured materials, for example, copper [2]. Secondly, there is the increased diffusivity of nanostructured material state. This leads to high sensitivity to the influence of surrounding. One of the most important type of this action is grain boundary fluxes from an external source, for example, coating [3, 4].