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Whole Quenching of Small Thin Plate with Low-Power Semiconductor Laser Based on Feed-Speed Combination Problem

Authors :
Toshiki Hirogaki
Keiji Ogawa
Yuki Manabe
Ryosuke Oda
Eiichi Aoyama
Source :
International Journal of Automation Technology. 10:923-933
Publication Year :
2016
Publisher :
Fuji Technology Press Ltd., 2016.

Abstract

A furnace is used in the conventional quenching of small work pieces. When quenching is performed using a furnace, the electricity consumption is high because the heating is performed over a long time period. Moreover, the working environment is unsatisfactory because quenching oils and salt baths are used in the process. Laser quenching has attracted considerable attention as a method for addressing these issues. In previous studies of this method, a laser was used to perform whole quenching on a sheet. However, problems such as deformation and tempering can arise during whole quenching on a thin plate. Furthermore, it is difficult to determine appropriate feed speeds and scanning orders. Therefore, in this paper, we propose a quenching method that uses a semiconductor laser to reduce these thin plate quenching problems. Additionally, an evaluation function is provided for quantitatively assessing the feed speeds. We strive to determine the appropriate laser scanning order from an understanding of decreases in hardness and transformation. We then used the evaluation function to appropriately set the feed speed for the whole quenching of a thin plate using a laser. As a result, we were ultimately able to select a suitable feed speed at which whole quenching can be performed.

Details

ISSN :
18838022 and 18817629
Volume :
10
Database :
OpenAIRE
Journal :
International Journal of Automation Technology
Accession number :
edsair.doi...........b37df5db28177adf73b4f37619e183e6
Full Text :
https://doi.org/10.20965/ijat.2016.p0923