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Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction

Authors :
Jaewon Lee
Eungchul Kim
Chulwoo Bae
Hyunho Seok
Jinil Cho
Kubra Aydin
Taesung Kim
Source :
Materials Science in Semiconductor Processing. 159:107349
Publication Year :
2023
Publisher :
Elsevier BV, 2023.

Subjects

Subjects :
Mechanics of Materials
Mechanical Engineering
General Materials Science
Condensed Matter Physics

Details

ISSN :
13698001
Volume :
159
Database :
OpenAIRE
Journal :
Materials Science in Semiconductor Processing
Accession number :
edsair.doi...........b3d00977029c35315b6a4fd47736331a
Full Text :
https://doi.org/10.1016/j.mssp.2023.107349
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