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Dynamic active cooling for improved power system reliability

Authors :
Alberto Castellazzi
Wei Juin Choy
Pericle Zanchetta
Source :
Microelectronics Reliability. 51:1964-1967
Publication Year :
2011
Publisher :
Elsevier BV, 2011.

Abstract

This paper presents the development of an adaptive cooling methodology in which the thermal impedance of the power system is continuously varied as a function of both its power dissipation and ambient temperature. As compared with a fixed parameter cooling solution, such an approach enables for a reduction of the amplitude of thermal cycles and the improvement of overall system efficiency and operational lifetime. The study comprises of an initial theoretical part and of subsequent experimental proof-of-concept demonstration of the proposed cooling strategy.

Details

ISSN :
00262714
Volume :
51
Database :
OpenAIRE
Journal :
Microelectronics Reliability
Accession number :
edsair.doi...........b483bc6461fb4e588fde985a10e33eca