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Dynamic active cooling for improved power system reliability
- Source :
- Microelectronics Reliability. 51:1964-1967
- Publication Year :
- 2011
- Publisher :
- Elsevier BV, 2011.
-
Abstract
- This paper presents the development of an adaptive cooling methodology in which the thermal impedance of the power system is continuously varied as a function of both its power dissipation and ambient temperature. As compared with a fixed parameter cooling solution, such an approach enables for a reduction of the amplitude of thermal cycles and the improvement of overall system efficiency and operational lifetime. The study comprises of an initial theoretical part and of subsequent experimental proof-of-concept demonstration of the proposed cooling strategy.
- Subjects :
- Engineering
business.industry
Thermal resistance
Dissipation
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Automotive engineering
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Reduction (complexity)
Electric power system
Reliability (semiconductor)
Amplitude
Thermal
Active cooling
Electronic engineering
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
business
Subjects
Details
- ISSN :
- 00262714
- Volume :
- 51
- Database :
- OpenAIRE
- Journal :
- Microelectronics Reliability
- Accession number :
- edsair.doi...........b483bc6461fb4e588fde985a10e33eca