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Analysis and Optimization of the Packaging Process for Supper Large-size CMOS Image Sensor
- Source :
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
- Accession number :
- edsair.doi...........b53079a217cfdf21bf9f5ac59b8df3d0