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A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

Authors :
Hongwen Zhang
Sze Pei Lim
Samuel Lytwynec
Tyler Richmond
Tybarius Harter
Source :
2022 International Conference on Electronics Packaging (ICEP).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 International Conference on Electronics Packaging (ICEP)
Accession number :
edsair.doi...........b54fe487006a1b18341c92fad12cb685

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