3D packaging architecture using paper as a dielectric medium

Radio frequency identification (RFID) can be utilized for the tagging of a wide variety of application. A planar inverted F antenna (PIFA) for real time locating has been designed, built and characterized on paper substrate. In specific the PIFA for tagging of metallic objects such as containers in ports or automotive applications is designed, fabricated, and characterized on a paper substrate. The antenna interconnect, or simply the shorting via A via, was drilled though the paper substrate using laser in one of the corners of the structure and, and is characterized by plotting S parameters. Agreement between simulation and measurements provide the proof of concept that paper is a good candidate for a multilayer low cost substrate. This effort proves for the first time, the feasibility of building 3D structure on paper with z-interconnects.