Pulse-Plating of Copper-Silver Alloys for Interconnect Applications

Subjects

Subjects :

Interconnection
Materials science
chemistry
Renewable Energy, Sustainability and the Environment
Pulse plating
Metallurgy
Materials Chemistry
Electrochemistry
chemistry.chemical_element
Condensed Matter Physics
Copper
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials

Details

ISSN :

19457111 and 00134651

Volume :

159

Database :

OpenAIRE

Journal :

Journal of The Electrochemical Society

Accession number :

edsair.doi...........b64b200c8e5b5c108d529a6393a81b47

Full Text :

https://doi.org/10.1149/2.066211jes