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Breakdown Strength of TiO2/Epoxy Nanocomposites Using Centrifugation Agglomerate Removal

Authors :
Takahiro Mabuchi
Muneaki Kurimoto
Takahiro Umemoto
Hirotaka Muto
Sigeyoshi Yoshida
Source :
IEEE Transactions on Dielectrics and Electrical Insulation. 28:74-81
Publication Year :
2021
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2021.

Abstract

In this study, TiO 2 /epoxy nanocomposites are evaluated for impulse and AC breakdown strength when agglomerations of TiO 2 nanofillers are removed by centrifugation. It is found that the nanocomposites with micrometric agglomerates exhibit lower breakdown strengths than that of unfilled epoxy resin. However, with the removal of agglomerates larger than 0.5 µm for 0.4 vol% filler concentration, the breakdown strengths are higher than that of unfilled epoxy resin. Micrometric agglomerates of TiO 2 nanoparticles behave as defects, thus lowering the breakdown strength of the nanocomposites. When such agglomerates are removed prior to curing, an improvement of the breakdown strengths is observed with very low filler concentration.

Details

ISSN :
15584135 and 10709878
Volume :
28
Database :
OpenAIRE
Journal :
IEEE Transactions on Dielectrics and Electrical Insulation
Accession number :
edsair.doi...........b6b7704bcc3b43f89ee4ff2fa4b3a522
Full Text :
https://doi.org/10.1109/tdei.2020.009005