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Breakdown Strength of TiO2/Epoxy Nanocomposites Using Centrifugation Agglomerate Removal
- Source :
- IEEE Transactions on Dielectrics and Electrical Insulation. 28:74-81
- Publication Year :
- 2021
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2021.
-
Abstract
- In this study, TiO 2 /epoxy nanocomposites are evaluated for impulse and AC breakdown strength when agglomerations of TiO 2 nanofillers are removed by centrifugation. It is found that the nanocomposites with micrometric agglomerates exhibit lower breakdown strengths than that of unfilled epoxy resin. However, with the removal of agglomerates larger than 0.5 µm for 0.4 vol% filler concentration, the breakdown strengths are higher than that of unfilled epoxy resin. Micrometric agglomerates of TiO 2 nanoparticles behave as defects, thus lowering the breakdown strength of the nanocomposites. When such agglomerates are removed prior to curing, an improvement of the breakdown strengths is observed with very low filler concentration.
- Subjects :
- 010302 applied physics
Filler (packaging)
Materials science
Nanocomposite
Nanoparticle
Epoxy
01 natural sciences
chemistry.chemical_compound
chemistry
Agglomerate
visual_art
0103 physical sciences
Titanium dioxide
visual_art.visual_art_medium
Electrical and Electronic Engineering
Composite material
Dispersion (chemistry)
Curing (chemistry)
Subjects
Details
- ISSN :
- 15584135 and 10709878
- Volume :
- 28
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Dielectrics and Electrical Insulation
- Accession number :
- edsair.doi...........b6b7704bcc3b43f89ee4ff2fa4b3a522
- Full Text :
- https://doi.org/10.1109/tdei.2020.009005